|
HS Code |
700542 |
| Chemicalname | Diethylzinc |
| Chemicalformula | C4H10Zn |
| Casnumber | 557-20-0 |
| Molecularweight | 123.5 g/mol |
| Appearance | Colorless, pyrophoric liquid |
| Purity | ≥99.999% (Metal basis, Electronic/EL Grade) |
| Boilingpoint | 117°C (243°F) |
| Density | 1.20 g/cm³ at 20°C |
| Meltingpoint | -28°C (-18°F) |
| Vaporpressure | 44 mmHg at 20°C |
| Solubility | Reacts with water, soluble in organic solvents |
| Storagetemperature | 2-8°C (Under inert atmosphere) |
| Unnumber | 1366 |
| Hazardclass | 4.2 (Substances liable to spontaneous combustion) |
| Synonyms | DEZ, Zinc diethyl |
As an accredited Diethylzinc (DEZ) Electronic/EL Grade factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Diethylzinc (DEZ) Electronic/EL Grade, 500 mL, packaged in a sealed stainless steel cylinder with secure valve, labeled and inert-gas purged. |
| Container Loading (20′ FCL) | Container Loading (20′ FCL): Packed in specialized containers, Max. capacity ~80-100 drums (200kg each), moisture-free, upright, compliant with safety regulations. |
| Shipping | **Shipping for Diethylzinc (DEZ) Electronic/EL Grade:** Diethylzinc (DEZ) is shipped in tightly sealed, corrosion-resistant cylinders or containers under inert gas. It is classified as a highly flammable, pyrophoric liquid and must be handled according to strict hazardous materials regulations, including labeling and documentation. Specialized carriers with experience in hazardous chemicals are required. |
| Storage | Diethylzinc (DEZ) Electronic/EL Grade should be stored in a tightly sealed container under an inert atmosphere, such as nitrogen or argon, to prevent contact with air and moisture. Keep in a cool, dry, and well-ventilated area away from heat, ignition sources, and incompatible materials like oxidizers or acids. Use proper safety protocols due to its pyrophoric and highly flammable nature. |
| Shelf Life | Diethylzinc (DEZ) Electronic/EL Grade has a typical shelf life of 12 months when stored tightly sealed under inert gas conditions. |
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Purity 99.999%: Diethylzinc (DEZ) Electronic/EL Grade with a purity of 99.999% is used in MOCVD processes for compound semiconductor manufacturing, where it ensures minimal impurity incorporation and optimal electronic properties. Vapor Pressure 15 mmHg@25°C: Diethylzinc (DEZ) Electronic/EL Grade with a vapor pressure of 15 mmHg at 25°C is used in thin film deposition for optoelectronic device fabrication, where it allows for precise zinc layer control and uniform film growth. Molecular Weight 123.5 g/mol: Diethylzinc (DEZ) Electronic/EL Grade with a molecular weight of 123.5 g/mol is used in the synthesis of ZnO nanostructures, where it facilitates reproducible morphology and controlled crystal structure. Stability Temperature <40°C: Diethylzinc (DEZ) Electronic/EL Grade stable below 40°C is used for safe transport and storage in advanced material synthesis labs, where it prevents premature decomposition and enhances handling safety. Low Water Content <10 ppm: Diethylzinc (DEZ) Electronic/EL Grade with water content below 10 ppm is used in high-purity LED epitaxy, where it minimizes hydrolytic defects and ensures high device yield. |
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Manufacturing at the edge of current electronics and optoelectronics projects brings a unique set of demands, not just for final device performance but for the invisible scaffolding that allows each circuit, MEMS, or display pixel to work reliably. Diethylzinc—DEZ—has become a key choice in metal-organic chemical vapor deposition (MOCVD) for those of us aiming to produce compound semiconductors and high-performance optoelectronic materials. Not all DEZ is identical, and any manufacturer who has fought unpredictable growth patterns or device inconsistencies after switching suppliers knows the stakes are high. We take the purity requirements of our DEZ Electronic/EL Grade with a kind of personal seriousness that comes from standing in the production space ourselves.
Our facility operates under strict conditions for air, raw material, and intermediates handling. Experience shapes every part of our process. Moisture and oxygen, two of the biggest threats to DEZ, receive the same attention as yield optimization—not because it’s written in a standard, but because one overlooked connection or a contaminated valve has left too many batches below requirements in years past. Our DEZ Electric/EL Grade batches regularly measure down to parts-per-billion ranges for trace alkali metals, transition metals, and other elemental impurities. We do this not just with one-off analytical testing, but by tracking and analyzing production batches from source to delivery, using methods such as ICP-MS and GC-MS for verifying contaminants. Each shipment out the door reflects our internal audit and a kind of trust: we won’t send out a product unless we'd use it ourselves for epitaxy or device layer growth.
Few things have changed the electronics industry’s approach to compound semiconductors like the shift to MOCVD-grown materials. Technologies such as LEDs, laser diodes, and high-electron-mobility transistors (HEMTs) rely on precise control of atomic interfaces between zinc, oxygen, nitrogen, and group III/V materials. Anyone who’s had to diagnose device failure at the wafer or pixel level has seen the impact of unintended dopant spikes, grain boundary separation, or unplanned color shifts. In our plant, technicians and engineers have lost sleep over the subtle knock-on effects of sub-par precursors, especially when a layer grown just a few nanometers too thick or too doped tips the balance for yield.
DEZ, as a zinc source, is often paired with organometallic or hydride sources for gallium, indium, or nitrogen. Its reactivity is no secret; everyone working with this material knows air, moisture, and trace halides lead to inconsistent growth and device failures. Each shipment of our DEZ for electronic and electroluminescent (EL) markets ships under rigorous exclusion practices—argon blanketing, specialty container materials, and inerted tracking—to suppress hydrolysis or oxidative side reactions. Over the years, we have responded to sudden shifts in substrate requirements, lamp power protocols, and reactor geometries, constantly adjusting handling instructions. Electronic customers increasingly require not just spec sheets but third-party validation. Our team has worked directly with end-users to validate DEZ purity by showing not just “after-the-fact” testing, but verification runs at the point of use on MOCVD tools, supporting side-by-side growth rates and defect free surfaces.
Most of the mainstream diethylzinc on the market today is made for applications in polymerization catalysis or as an intermediate reagent. That DEZ works well for chemical synthesis because industrial scale-up focuses on throughput, not on strict removal of metal or organic byproducts. Standard grades typically tolerate a parts-per-million impurity range; for a general chemical process, the residual sodium or minor transition metals don’t cloud the outcome. Semiconductor-grade manufacturing tells a different story. Device specs push toward purities above 99.999 percent (5N) and purity isn’t just a claim—inconsistencies in the source layer show up in device dark currents, output drop-offs, or reliability trouble after only a few weeks in the field.
Running our reactors for EL/Electronic Grade batches involves deep, batch-to-batch traceability for every possible variable, including precursor storage temperature, solvent batch origins, cleaning regime for glassware and valves, and air quality logged at every transfer step. Unlike outsourced or batch-blended variants, we never blend general DEZ with ultra-high-purity runs. “Contamination memory” in a manifold or fill line from one contaminated batch can undermine weeks of careful preparation. Our production engineers, some of whom have been with us since the first DEZ runs decades ago, have seen what happens when a suboptimal batch is sent semi-blindly to fabs or research lines. The result is usually a sharp uptick in complaint calls, wafer scrap, and a loss of trust that no cost savings can recover.
Device performance starts before crystal growth ever begins. Even the architecture of the DEZ containers—metal, valve seatings, seals—have been selected after working with end users fighting metal leaching or outgassing. We chose specialized container linings because customers using standard canisters found trace iron or silicon leaching altered their surface roughness. In one instance, a user in laser diode production detected unexplained “dead pixel” failures that were later correlated with a single drum's out-of-spec iron content. In response, we brought in our own in-house metallurgical analysis, and changed our drum supply and pre-load inspection process. None of that learning would ever show up in a product description, but it makes all the difference to operators expected to hit six sigma process yields in a competitive marketplace.
Some customers have moved towards modular, in-house purification steps. While it’s tempting for a fab team to think they can “clean up” industrial DEZ post-delivery, in practice this approach exposes the material to more contamination potential, variable removal efficiency, and little chance for defect resolution if things go wrong at volume. We’ve collaborated with multi-country display panel and LED fab lines extensively, which has underscored for us the value of building contamination mitigation into the source process, rather than relying on post-purification. Investing in on‑site analytics—ICP‑MS, trace moisture detection, advanced hydrocarbon profiling—has accelerated our root-cause analyses when problems occur.
Our work in developing DEZ Electronic/EL Grade isn’t just chemistry—it’s direct engineering experience. Our technical team attends installation startups to help with process troubleshooting. One electronics user, scaling from pilot to high-volume production, saw organometallic buildup lead to spontaneous reactor stoppages. Examining their full upstream process, our engineers traced it back to microcontaminants in valve plastics leaching into DEZ over time—not something visible in initial runs, but a variable that began to aggregate as lot sizes grew. Sharing the analysis, we implemented containment changes, revised our packaging selection, and followed up with process residual testing; their uptime increased, and we built a lasting relationship.
DEZ’s reactivity and utility make it irreplaceable for certain growth regimes. Our high-purity preparations ensure minimal “tailing” in vapor delivery, sharper interfaces for complex device layers, and reduction in parasitic growths. LED and display designers, particularly those scaling blue or green emission, rely on the strict batch purity for consistency in wavelength and quantum efficiency. Some of our oldest customers share their daily process measurements with us so we can correlate batch purity with device level results, allowing for joint process improvements—the kind of feedback loop most distributors never experience. It’s not only about meeting requirements, but about giving manufacturers confidence to push the boundaries of new design nodes and architecture.
The race towards next-generation displays, mini-LEDs, and micro-LEDs has placed even stricter demands on metallorganic source materials. Bulk orders and commodity price swings mean that some firms risk diluting standards in the push for volume. Our experience tells us that focusing on trace level impurity removal pays off most when competing on performance—yield improvements from a cleaner source often recoup the entire extra spend just by reducing fallouts in early wafer lots. As blue and green wavelengths saw surging demand for mobile displays and VR applications this past year, we optimized our syntheses, investing in additional purification steps and online analytics, prompted directly by line requests from customers moving to finer pitch.
Thermal management in DEZ also matters for production safety and stability. Each year we revise our standard operating procedures for filling, transport, and on-site handling, based on direct feedback from operators and maintenance teams rather than imposed compliance standards alone. Safety stories circulate—older plant personnel recall a time when improper venting during a container swap led to sudden exotherms and locally thick white zinc oxide deposits, all preventable with today’s built-in container trace heating and inerting. These lessons drive training, engineering controls, and logistics in how we supply and maintain DEZ for electronics use.
Supplying DEZ to market leaders in displays, semiconductors, and optoelectronics is not only about purity numbers. Our logistics team—formerly operators themselves—understand what happens during inventory turns, long-journey shipments, or warehouse delays. We coordinate air and land shipments, prequalify all delivery partners for inert material compatibility, and perform random spot checks not because a customer requests it, but because we know from experience that a transit mistake today writes off a month’s worth of fab output tomorrow. Our customers need traceability on every drum, delivery time reliability to avoid shutdowns, and fast-turn replacements in case of emergency—all informed by years of building contingency plans out of real crisis moments in the field.
Growing awareness about the environmental footprint and regulatory environment has also changed how we manage DEZ production and waste streams. Compared to large-scale industrial DEZ, our electronics line processes all washout and vent streams through specialized reclamation and destruction units. We provide post-use container cleaning and collect empty drums for recycling, not merely to “tick the box” on compliance but because those of us with family living near major chemical plants know the stakes and scrutiny are only rising. Our customers expect carbon and ecological accountability—often sharing their own requirements and metrics with us. Working from this baseline, our technical staff continues to research new synthetic routes for DEZ targeting improved atom economy and reduced energetic cost.
Regulatory requirements for electronic-grade organometallics have become more nuanced every year. Semiconductor end-users bring us questions about best practices not just for storage, but for full-lifecycle risk minimization. Our safety protocols draw directly from past experience in process incidents, not theory—down to how we maintain evacuation drills in the container loading zone, rotate out PPE based on field reports, and keep technical bulletins up-to-date from incidents flagged across our own and customer facilities. Many of our staff have attended cross-industry safety symposiums, contributed to failure analysis workshops, and brought that know-how back into our own operations.
Customers often ask us for real-world examples of compliance in action. In the past year, for instance, rail shipments destined for a partner’s Southeast Asia fab met emerging regional rules for trace hazardous vapor monitoring. We pre-fitted advanced pressure and moisture sensors for every drum, leveraging knowledge learned from previous customer audits. Shipments passed all customs and inspection events without a single warning—something many competitors struggled with. This level of transparency and cooperation, rooted in long-term know-how, supports the secure and scalable supply that new electronics infrastructure now counts on.
Our close work with customers often starts with troubleshooting. A gallium nitride LED fab encountering subtle blue shift during ramp-up might flag suspect DEZ lots for us to analyze together. We invite customers to send in their process samples, matching device performance issues against our batch history and impurity profiles. Cooperative problem solving with operators and process engineers—not just procurement teams—means we can anticipate changes in reactor design, new cleaning steps, or alternate gas protocols. Our technicians often stand alongside fab engineers running trial growths, evaluating by cross-sectional STEM or AFM for every new DEZ synthesis run. No spreadsheet ever replaces practical know-how earned at the plant floor and in the lab.
Industry leaders increasingly push for proactive supply alignment—joint forecasting, coordinated maintenance, and redundancy planning—to prevent any shortfall or unplanned downtime. Our team meets regularly with electronics manufacturers to discuss quarterly plans, gauge upcoming design changes, and talk about what improvements we can make directly within the DEZ synthesis or logistics chain. These discussions shape our investment decisions: adding purification columns, investing in quality automation, or trialing new container handling. Through every cycle, we build up a living history of shared challenges and real solutions—not abstract metrics, but process tweaks and preventive actions grown from direct feedback.
Manufacturing DEZ for electronics use requires more than just chemical expertise; it demands accountability, a willingness to work on problems shoulder-to-shoulder with customers, and a memory for lessons learned. Purity targets and supply consistency stand as just the starting points—what distinguishes our DEZ Electronic/EL Grade is the daily application of real-world experience, from synthesis to delivery. The result: a product that lets engineers, researchers, and production managers push ahead with confidence, knowing their source material comes from a team as committed to their outcomes as their own colleagues in the fab.