|
HS Code |
532057 |
| Chemical Name | Chlorine |
| Molecular Formula | Cl₂ |
| Molar Mass | 70.90 g/mol |
| Cas Number | 7782-50-5 |
| Physical State | Gas |
| Color | Greenish-yellow |
| Odor | Pungent, irritating |
| Purity Electronic El Grade | ≥99.999% |
| Boiling Point | -34.04°C |
| Melting Point | -101.5°C |
| Density At 0 C 1 Atm | 2.994 g/L |
| Vapor Pressure At 20 C | 6.87 atm |
| Solubility In Water | 0.73 g/100 mL at 20°C |
| Un Number | 1017 |
| Hazard Class | 2.3 (Toxic gas) |
As an accredited Chlorine (Cl₂) Electronic/EL Grade factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Chlorine (Cl₂) Electronic/EL Grade is supplied in 50-liter high-pressure steel gas cylinders, fitted with CGA valve connections and safety seals. |
| Container Loading (20′ FCL) | Container loading (20′ FCL) for Chlorine (Cl₂) Electronic/EL Grade involves secure, leak-proof packaging in cylinders or ton containers, ensuring compliance. |
| Shipping | Chlorine (Cl₂) Electronic/EL Grade is shipped in high-pressure, corrosion-resistant cylinders or ton containers. It is classified as a hazardous material (UN 1017), requiring secure, upright transport with proper labeling. Specialized carriers ensure leakage prevention, temperature control, and compliance with international and local chemical safety regulations throughout transit. |
| Storage | Chlorine (Cl₂) Electronic/EL Grade should be stored in tightly sealed, corrosion-resistant gas cylinders, upright in a cool, dry, and well-ventilated location, away from direct sunlight, heat sources, and incompatible substances such as ammonia and organics. Cylinders must be clearly labeled and secured to prevent tipping. Use in designated gas storage areas with appropriate leak detection and emergency equipment available. |
| Shelf Life | Chlorine (Cl₂) Electronic/EL Grade typically has a shelf life of 3 years when stored in tightly sealed, corrosion-resistant containers. |
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Purity 99.999%: Chlorine (Cl₂) Electronic/EL Grade with purity 99.999% is used in semiconductor wafer cleaning processes, where ultra-high purity ensures removal of organic and inorganic contaminants for improved device yield. Moisture content <1 ppm: Chlorine (Cl₂) Electronic/EL Grade with moisture content <1 ppm is used in plasma etching of silicon wafers, where extremely low moisture minimizes oxide defects and enhances etching precision. Stable cylinder pressure: Chlorine (Cl₂) Electronic/EL Grade featuring stable cylinder pressure is used in thin film deposition, where consistent gas flow supports uniform layer formation and reproducible film properties. Metal impurity <0.5 ppb: Chlorine (Cl₂) Electronic/EL Grade with metal impurity levels below 0.5 ppb is used in LCD panel manufacturing, where low metal content prevents electrical shorts and enhances panel reliability. Stability temperature up to 50°C: Chlorine (Cl₂) Electronic/EL Grade with stability temperature up to 50°C is used in advanced integrated circuit photolithography, where thermal stability maintains consistent reactivity and process control. |
Competitive Chlorine (Cl₂) Electronic/EL Grade prices that fit your budget—flexible terms and customized quotes for every order.
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Few chemicals put a production plant’s reputation on the line as completely as electronic grade chlorine. Making Cl2 for semiconductor fabrication means reaching a level of purity far beyond what most industries require. As a manufacturer, we have always found that attention to detail, sharp controls, and relentless checks separate us from producers of industrial grades. Chlorine for PVC or pulp bleaching can tolerate trace metals, organic residues, and moisture levels that spell disaster for thin-film transistor processes and silicon wafer surface preparation. Stories circulate across the industry about a single sub-par batch causing weeks of equipment cleaning or even a full stop on fab lines. We measure our role and responsibilities through those stories as well as technical data.
Raw materials, process gases, and feedstocks destined for electronic chlorine production undergo precise selection. Conventional chlorine plants use diaphragm, membrane, or mercury cell technology. Each has its own contamination pitfalls. Early on, we realized that cell internals, coatings, and maintenance chemicals eventually enter the end product. To qualify an offering as electronic grade, we switched from legacy cells to coated membrane processes tailored for low leachable metals and non-porous boundaries. All welds, flange gaskets, and valves in the chlorine path use alloys and PTFE which do not leach metallic ions or organics. Each time we upgrade equipment, the yards of stainless and kilometers of fluoropolymer cost more up front than standard steel or elastomers, but such investments keep nickel, copper, iron, and silica levels almost undetectable.
Our operators used to check for product color, then add on-site driers after shipment. That strategy never worked for fabrication labs seeking tens of ppb of moisture or lower. Early batches failed not because of intention, but because standards were so different for what electronics facilities demanded and what bulk chemical plants felt was “clean.” We rethought how to monitor everything from vent traps to filling lines. Today, we steer every step using high-performance liquid chromatography, atomic absorption, ICP-MS, and even electron microscopy on outgoing samples. Fail a batch at any point—for silane, sodium, water vapor, or dozens of other targets—and it never touches a customer cylinder.
Customers with semiconductor wafer or thin-film application backgrounds already recognize that bulk chlorine found on most distributor price lists will not fit their process tools. Bulk producers generally talk ppm-level contamination at best, though even that can be optimistic considering packaging, filling conditions, and batch-to-batch drift. We secure parts-per-billion control for metals and halide co-contaminants by integrating high-surface-area scrubbers, catalytic beds, and triple purification checkpoints. Those are not afterthoughts, applied at the last moment, but built into plant layouts and process recipes.
Older industrial grades introduce complications. For instance, diaphragm cell chlorine accumulates asbestos or sodium compounds. Mercury cell plants show trace mercury, which can plate out or trigger corrosion. These scenes never get a foothold in our ultra-high-purity output, as every engineering change filters through technical risk reviews focused as much on customer fab performance as on plant reliability.
There are few areas as critical as packaging logistics. Early experiments showed us even minute cylinder oxidation, local weld corrosion, or elastomer gaskets ruin a batch tailored for electronic use. We switched entirely to nickel-lined and electropolished containers, triple-cleaned and dried under vacuum. Fill stations sit in nitrogen-purged rooms, with continuous particle and moisture monitoring. Each run adopts a “forward only” protocol: outgas and dry the line, fill, seal, and never allow backflow or cross-connection with other grades. Shipping routes, even the trucks themselves, run under a compliance plan so that transit never translates into impurity pickup.
Chlorine is notoriously corrosive, especially in contact with moisture. Every time a shipment goes out, operators and logistics staff inspect the package for color change, liner wear, and even micro-pits in welds. By tracking container histories and retiring or reconditioning them between each use, we maintain control further downstream than a typical commodity chemical supplier ever attempts. With each container, we occupy a position closer to our customers’ cleanroom protocols than to our own industry’s historical shortcuts.
For electronics fabrication, a vanishingly small amount of contamination creates issues impossible to hide. High temperatures and plasma etching enhance even trace impurities, leaving residues or etching defects. We have seen silicon carbide or gallium arsenide processes crippled by a single ppb sodium spike or as little as 0.5 ppm water vapor. Those volumes would slide unnoticed in water treatment or textile bleaching gigs. Electronic devices built for high density, speed, and reliability, on the other hand, need every aspect of process chemistry dialed in to its purest version—no exceptions.
Each time a client reported an unexplained wafer defect or device dropout, analysis often traced the culprit to a surface-absorbed metal or an invisible organic impurity. We mapped contamination pathways back to processing, seeing how compromised diaphragm materials or temporary line connections, invisible to the naked eye, could seed flaw clusters over thousands of downstream devices. Out of necessity, we’ve made cleanroom thinking second nature, not only at the last stage of packaging but from the raw material silo through final inspection.
Technology never stays still. Every generation of device shrinks features, increases aspect ratio, stacks more layers, and needs cleaner interfaces. Specifications for trace metals, sulfur compounds, oxygenates, and hydrocarbons inch downward year by year. In the earliest days, Cl2 users wanted metals in the tens of ppb, moisture just under a ppm, and hydrocarbon content “as low as possible.” Now, some clients hand us lists demanding individual isotope monitoring, with targets too small to quantify without reference standards of our own design.
We face regular requests for detailed lot histories, root cause deep-dives, and batch-retained samples ready for third-party audit. Each request reflects hard engineering limits at the client’s fab and ever-tighter yield windows as chips become more complex. Rather than resist, we update our analytics lab, deploy new separation columns, and swap to instrumentation with lower detection limits. We maintain relationships with university surface analysis groups and independent testing labs for cross-validation and method improvement.
Semiconductor etching may be the most familiar use of EL grade Cl2, but our customers have expanded applications into TFT-LCD displays, photovoltaic device structures, compound transistor manufacturing, and MEMS component cleaning. In each use, a specific set of impurities causes pain, whether pitting glass in display lines or disrupting dopant profiles in advanced power electronics. The days of “one purity fits all” never existed for us. We keep production capability agile, so different clients receive product lots meeting their unique patterns of critical and trace impurity.
We keep current on where Cl2 sits in dry etch chemistry, photoresist removal, contact hole and via treatment, and even high-purity chemical vapor deposition precursor production. Nearly every month, a discussions begins with a client experimenting in device scaling or structure innovation. They do not ask for a catalog grade; they bring us new challenges around even lower halide or micro-particle contamination. Strong relationships with end users have taught us that documentation and accountability matters just as much as molecule count when devices go to mass production.
Delivering any form of Cl2 takes a commitment to safety, but high-purity chlorine intensifies the risks. Facilities that can destroy batches due to minor contamination, also risk chemical incidents if safety routines slip. We long ago instituted redundant leak testing, remote manifold purge systems, and automatic isolation valving at every collection and packaging point. Safety is not an afterthought; we embed it throughout SOPs, with every new team member drilled in both technical handling and immediate containment.
Many of our end users operate with negative room pressures, local scrubber exhausts, and full personal protection routines. We liaise with fab engineers and EH&S leaders, offering training in cylinder change-out, leak detection, and local ventilation. Even containers engineered for lowest outgassing and corrosion undergo pressure cycling and impact tests to head off rare but potent failure points. As the stakes for human safety and device failure rise, so does our vigilance in how every molecule moves from our site to the customer process chamber.
Electronics manufacturers require more than a purity label. They want chronologies, container logs, and verified chain of custody. Our records track each step of production—date and time a batch leaves the cell, who sampled the lot, every analytical value flagged above a running control. Every cylinder carries a full analysis packet including water, metals, oxychlorides, and a breakdown of potential halide cross-contamination.
Sometimes, a fab will question a single periodic spike, or trace back through multiple shipments to pin down a yield excursion. We maintain archives of production samples and analytical spectra, not only for regulatory purposes but as standard practice. Our commitment to factual transparency means never burying outlier results—a lesson from early days where obscuring a batch deviation could lead to months of lost production or tens of millions in device failures downstream. Full access, open reporting, and rapid incident investigation set our EL grade chlorine apart from bulk industrial supply chains fixated on throughput rather than reliability.
Behind every batch of electronic chlorine sits a team skilled in advanced process analytics and continuous improvement. Analytical chemists and instrumentation engineers spend years optimizing detection methods for increasingly elusive contaminants, while operators bring discipline to handling, maintenance, and validation. We hold weekly process reviews—data trending, outlier analysis, yield correlations, and cross-checks against customer feedback. When specific customer devices trend toward smaller geometries or layer complexity swings, our teams forecast how new impurity types might emerge, then adapt production to stay compliant.
From plant manager to cylinder washer, every person in our facility takes turns at extra training on contamination control, gas handling safety, and emergency protocol refreshers. Frequently, improvements bubble up from those closest to the work—new valve cleaning sequences, better container life tracking, more sensitive leak checks in storage. We use a root-cause approach: when any lot fails, the entire process segment gets a full dissection. Only proven corrective actions get folded into production, whether that means a tighter fill line, a new spectrographic check, or a revised shipment rotation.
Semiconductor chemistry grows more demanding every cycle. We see the most innovative fab lines asking not just for cleaner chlorine but for application guidance. End users share their device structures, mask stacks, and chronic contamination problems. Those conversations drive us to redesign purification beds, invest in better argon spargers for drying, and rewrite calibration routines. Sometimes, we spend weeks comparing third-party reference samples against internal standards to resolve a single persistent impurity peak in a customer’s process monitoring logs. That level of involvement cannot happen unless R&D and production line up to approach process change from a foundation of evidence.
The wider the gap between what commodity chlorine provides and what electronic lines require, the more we treat high-purity production as a long-term technical partnership with customers. From trace halogen scavenging to specialty metal traps, the line between success and failure keeps shrinking. By building a direct channel between the people making the material and those tuning its use inside front-end or back-end fab tools, we get tighter process windows and fewer surprises.
Cleanroom standards do not mean environmental impact disappears. Agencies scrutinize chlorine facilities from brine sourcing through emission control and byproduct management. Years of audits, effluent testing, and air monitoring have shaped our thinking about “clean” in both the micro and macro sense. Unlike bulk commodity production, electronic Cl2 generates far less tolerance for deviation or downtime, and waste minimization goes hand-in-hand with purity control.
To stay aligned with the sharpest environmental standards, we install redundant scrubbers, monitor every emission point, and design water treatment processes for zero liquid discharge where possible. The best new ideas often originate in solving environmental bottlenecks—e.g., finding a less reactive de-chlorination chemical that does not spike process burden elsewhere or retrofitting brine tanks with multi-stage filtrations that shrink waste loads and cut sodium carryover by orders of magnitude. Staying in front of regulatory mandates makes us more competitive and, more importantly, secures confidence with users investing hundreds of millions in facility qualification and environmental impact statements.
Our experience convinces us Cl2 electronic/EL grade sits at the threshold between the chemical plant and the cleanroom. Its value stands in how few parts per billion of the wrong element ever make it through. For customers, a true product introduction hinges less on tables of specifications, more on the lived-in reliability that comes from hands-on experience, adaptation, and accountability. No catalog or datasheet substitutes for a direct line to the team behind each fill, every retest, and every batch check.
For the next generation of chips, displays, and microelectromechanical components, pure chlorine makes the difference between a well-yielding lot and a billion-dollar misstep. That is where we spend our energy: building confidence in every step of the high-purity chlorine journey. Each filled cylinder contains not just a gas, but a pledge—born out of years in the field, late-night failure analysis sessions, and the clear recognition that in our world, purity never goes out of style.